MPi Parametric Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is extensively utilized on gold bump and pad wafer screening for display driver, logic, and memory unit. MPI’s cantilever probes would be the corresponding response into the demands of fi­ne pitch, little pad measurement, substantial pace, a lot less cleaning, multi-DUT, large pin count, and extremely-small leakage requirements. With superb craftsmanship, modern architecture and verified methodologies depending on mechanical and electrical simulation/measurement outcomes, making MPI the top cantilever provider worldwide.


FCB Probe Card

The FCB Probe Card is easily the most mature engineering of buckling beam probe card. It's aimed to accomplish the semiconductor ship manufacture time-to-market (TTM) and price of examination (COT) demand. FCB is usually a established Resolution for a range of semiconductor output checks from early engineering pilot-operates to substantial volume manufacturing (HVM). FCB is ready for gadget requiring higher sign integrity probing (SI) and/or electricity integrity probing (PI). Applications include things like cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB ensures the globe’s very best Total Price tag-of-ownership (COO) for different DUT apps.


EVS Probe Card

The EVS Probe Card can be an enhancement about the standard buckling beam probe card. Key functions are increased present-day carrying capacity (C.C.C.) and decrease balanced Get in touch with power (BCF), along with overall MEMS-like qualities. EVS can easily satisfy the need of Sophisticated wafer probing. Precise alignment and exceptional planarity Regulate would be the essential things contributing to secure Get in touch with resistance. With its capability and functionality, EVS Probe Card is a super choice for Superior probe cards.


Osprey probe card

The Osprey probe card is MPI’s Answer to need for ever finer pitch. It can be created for lesser Al pad, and is ideal for very small pitch application with peripheral and comprehensive array pattern. With precise alignment and far better planarity control, Osprey can get to larger check here efficiency by multi-DUT design.  The forming wire (FW) kind needle created with MPI’s individual micro fabrication process don't just delivers higher-high quality efficiency but also allows straightforward needle substitute and shortens preserving cycle time.



Kestrel Probe Card

The Kestrel Probe Card is supplied with MEMS wire (MW) needle and that is created for the desire of minimal pressure probing. What's more, it comes with the chance to satisfy large C.C.C. and large pin counts application. The MEMS process makes sure really reliable needle features, plus the Specific construction design permits exact alignment and planarity Manage.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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